The printed circuit board multilayer construction according to claim 1, wherein the at least one liquid-impermeable membrane is inserted in the layer stack over the entire area of the areal extent of the layer stack. The printed circuit board multilayer construction according to claim 2, wherein the cavity is embodied as a through hole or as a depth milling. The printed circuit board multilayer construction according to claim 1, wherein the cavity is produced by milling or stamping of an inner film or of a multilayer core and by sandwiching with further inner films, prepreg layers or multilayer cores, and is closed on one side or on both sides except the opening.
A printed circuit board multilayer construction, comprising: a layer stack of several electrically insulating and/or conductive layers arranged one above the other anda cavity in an interior of the layer stack, wherein the cavity extends laterally only into a partial region of an areal extent of the layer stack, and through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction wherein the cavity is sealed relative to ingress of liquid with an aid of at least one liquid-impermeable membrane that is laminated in between layers of the layer stack wherein the at least one liquid-impermeable membrane is inserted in the layer stack and extends only partially over the areal extent of the insulating layers. A printed circuit board multilayer construction, comprising: a layer stack of several electrically insulating and/or conductive layers arranged one above the other anda cavity in an interior of the layer stack, wherein the cavity extends laterally only into a partial region of an areal extent of the layer stack, and through an opening provided in the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction wherein the cavity is sealed relative to ingress of liquid with an aid of at least one liquid-impermeab.ġ. Furthermore, the present invention relates to a method suitable for producing a printed circuit board multilayer construction of this type.ġ.
Furthermore, the present invention relates to a method suitable for p.Ī printed circuit board multilayer construction comprising a layer stack composed of plurality of electrically insulating and/or conductive layers arranged one above another and a cavity in the interior of the layer stack, which extends laterally only in a partial region of the areal extent of the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction through an opening provided in the layer stack and is sealed relative to ingress of liquid.
A printed circuit board multilayer construction comprising a layer stack composed of plurality of electrically insulating and/or conductive layers arranged one above another and a cavity in the interior of the layer stack, which extends laterally only in a partial region of the areal extent of the layer stack, is exposed to a pressure surrounding the printed circuit board multilayer construction through an opening provided in the layer stack and is sealed relative to ingress of liquid.
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